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XR20M1172 Datasheet(PDF) 5 Page - Exar Corporation |
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XR20M1172 Datasheet(HTML) 5 Page - Exar Corporation |
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5 / 57 page  XR20M1172 5 REV. 1.0.0 TWO CHANNEL I2C/SPI UART WITH 64-BYTE FIFO Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain. GPIO7/RIA# 28 28 I/O General purpose I/O pin or UART Ring-Indicator. If this pin is an input and is unused, it should be connected to VCC or GND. If this pin is an output and is unused, it should be left unconnected. See IOControl[1] and IODir register. VCC 29 1 Pwr 1.62V to 3.63V power supply. A0/CS# 30 2 I I2C-bus device address select A0 or SPI chip select. If I2C-bus config- uration is selected, this pin along with the A1 pin allows user to change the device’s base address. If SPI configuration is selected, this pin is the SPI chip select pin (Schmitt-trigger, active LOW). A1/SI 31 3 I I2C-bus device address select A1 or SPI data input pin. If I2C-bus onfiguration is selected, this pin along with A0 pin allows user to change the device’s base address. If SPI configuration is selected, this pin is the SPI data input pin. I2C/SPI# 32 4 I I2C-bus or SPI interface select. I2C-bus interface is selected if this pin is HIGH. SPI interface is selected if this pin is LOW - PAD - Pwr The center pad on the backside of the QFN package is metallic and is not electrically connected to anything inside the device. It must be sol- dered on to the PCB and may be optionally connected to GND on the PCB. The thermal pad size on the PCB should be the approximate size of this center pad and should be solder mask defined. The solder mask opening should be at least 0.0025" inwards from the edge of the PCB thermal pad. NC 1, 8 - - No Connection. Pin Description NAME 32-QFN PIN # 28-TSSOP PIN# TYPE DESCRIPTION |
Similar Part No. - XR20M1172 |
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Similar Description - XR20M1172 |
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