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CDR31BP109BCSP Datasheet(PDF) 1 Page - Kemet Corporation

Part No. CDR31BP109BCSP
Description  CERAMIC CHIP/MIL-PRF-55681
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Maker  KEMET [Kemet Corporation]
Homepage  http://www.kemet.com
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CDR31BP109BCSP Datasheet(HTML) 1 Page - Kemet Corporation

 
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©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET
SIZE
T
STYLE
CODE
L
W
MIN.
MAX.
BW
CDR01
C0805
2.03 ±.38 (.080 ±.015)
1.27 ±.38 (.050 ±.015)
.56 (.022)
1.40 (.055)
.51 ± 0.25 (.020 ±.010)
CDR02
C1805
4.57 ±.38 (.180 ±.015)
1.27 ±.38 (.050 ±.015)
.56 (.022)
1.40 (.055)
.51 ± 0.25 (.020 ±.010)
CDR03
C1808
4.57 ±.38 (.180 ±.015)
2.03 ±.38 (.080 ±.015)
.56 (.022)
2.03 (.080)
.51 ± 0.25 (.020 ±.010)
CDR04
C1812
4.57 ±.38 (.180 ±.015)
3.18 ±.38 (.125 ±.015)
.56 (.022)
2.03 (.080)
.51 ± 0.25 (.020 ±.010)
+.51
+.020
+.51
+.020
CDR05
C1825
4.57
.180
6.35
.250
.51 (.020)
2.03 (.080)
.51 ± 0.25 (.020 ±.010)
–.38
–.015
–.38
–.015
CDR06
C2225
5.72 ±.51 (.225 ±.020)
6.35 ±.51 (.250 ±.020)
.51 (.020)
2.03 (.080)
.51 ± 0.25 (.020 ±.010)
CDR31
C0805
2.00 ±.20 (.078 ±.008)
1.25 ±.20 (.049 ±.008)
1.30 (.051)
.50 ± 0.20 (.020 ±.008)
CDR32
C1206
3.20 ±.20 (.125 ±.008)
1.60 ±.20 (.062 ±.008)
1.30 (.051)
.50 ± 0.20 (.020 ±.008)
CDR33
C1210
3.20 ±.25 (.125 ±.010)
2.50 ±.25 (.098 ±.010)
1.50 (.059)
.50 ± 0.25 (.020 ±.010)
CDR34
C1812
4.50 ±.25 (.176 ±.010)
3.20 ±.25 (.125 ±.010)
1.50 (.059)
.50 ± 0.25 (.020 ±.010)
CDR35
C1825
4.50 ±.30 (.176 ±.012)
6.40 ±.30 (.250 ±.012)
1.50 (.059)
.50 ± 0.30 (.020 ±.012)
()
CERAMIC CHIP/MIL-PRF-55681
CERAMIC
SIZE CODE
See Table Above
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
CAPACITANCE TOLERANCE
BC
D
F
J
K
M
±
.1 pF ±.25 pF ±.5 pF ±1%
±
5% ±10% ±20%
FAILURE RATE LEVEL (%/1000 hrs.)
M — 1.0
R — 0.01
P — 0.1
S — 0.001
TERMINATION FINISH
S — Solder Coated, Final
W — Base Metalization—
(SolderGuard I)
Barrier Metal—Tinned
U — Base Metalization—
Tin or (Tin/Lead Alloy)
Barrier Metal—Solder
SolderGuard II
Coated (SolderGuard I)
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin) Solderguard II
CAPACITANCE TOLERANCE
BC
D
F
J
K
M
±.1 pF ±.25 pF ±.5 pF
±1%
±5%
±10%
±20%
RATED VOLTAGE
A — 50; B — 100
END METALIZATION
C — SolderGuard II
(100% Sn) (Military equiv: Y, W)
H — SolderGuard I
(Sn60) (Military equiv: S, U)
FAILURE RATE (%/1,000 hrs.)
M — 1.0
R — 0.01
P — 0.1
S — 0.001
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
VOLTAGE
1 — 100V, 5 — 50V
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CAPACITOR OUTLINE DRAWINGS
DIMENSIONS—MILLIMETERS AND (INCHES)
Note: For Solderguard I (MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width/Thickness
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
()
CDR01
B
P
101
B K
S M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P
101
K
1
G
M
C*
CHIP DIMENSIONS
BW
W
L
T
“SOLDERGUARD I” *
SOLDER
NICKEL
SILVER
METALLIZATION
ELECTRODES
“SOLDERGUARD II”
TINNED
NICKEL
SILVER
METALLIZATION
ELECTRODES
Military Designation - “S” or “U”
KEMET Designation - “H”
Military Designation - “W” or “Y”
KEMET Designation - “C”
* Part Number Example: C0805P101K1GMC
(14 digits - no spaces)
87


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