©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

C

0805

C

102

K

C

R

A

C

Style

C - Ceramic

Chip Size

0805; 1206; 1210; 1808;

1812; 1825; 2220; 2225

Specification

C - Standard

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

C = ±0.25pF*

J = ±5%

D = ±0.5pF*

K = ±10%

F = ±1%*

M = ±20%

G = ±2%*

* Contact KEMET Sales for availability.

Voltage

C = 500V

G = 2000V

D = 1000V

Z = 2500V

F = 1500V

H = 3000V

Temperature Characteristic

Designated by Capacitance

Change over Temperature Range

G – (C0G) (±30ppm/C) (-55°C +125°C)

R – X7R (±15%) (-55°C +125°C)

End Metallization

C = Standard

Failure Rate Level

A = Not Applicable

Capacitor Ordering Information

Property

Specification

Capacitance

C0G: 1 pF to 0.010 µF

X7R: 10 pf to 0.22 µF

25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for

≤ 1000 pF (C0G only)

Cap Tolerance

C0G: C*, D*, F*, G*, J, K, M

* Contact KEMET Sales for availability.

X7R: J, K, M

DF

C0G: 0.1% Max

X7R: 2.5% Max

Voltage Ratings

500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V

Operating Temperature Range

From -55C to +125C

25ºC IR @ 500V

100 G

Ω or 1000 MΩ-µF, whichever is less

125ºC IR @ 500V

10 G

Ω or 100 MΩ-µF, whichever is less

-55ºC TCC

+125ºC TCC

X7R: + 15%

C0G: + 30 ppm / ºC

Dielectric Strength

150% of Rated Voltage for Rated Voltage <1000 V

120% of Rated Voltage for Rated Voltage >=1000V

Ripple Current

Consult KEMET Sales Representative

Electrical Parameters

Marking

These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.

Packaging

KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk

Soldering Process

The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and

larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of

pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of

Recommended Solder Pad Dimensions

the termination.

bag as outlined on page 8

3. Please consult factory for waffle packaging options.

Details on the marking format is located on page 9

7.

mm

in.

mm

in.

mm

in.

mm

in.

0805

3.30

0.130

0.70

0.028

1.60

0.063

1.30

0.051

1206

4.50

0.177

1.50

0.059

2.00

0.079

1.50

0.059

1210

4.50

0.177

1.50

0.059

2.90

0.114

1.50

0.059

1808

5.90

0.232

2.30

0.091

2.40

0.094

1.80

0.071

1812

5.90

0.232

2.30

0.091

3.70

0.146

1.80

0.071

1825

5.90

0.232

2.30

0.091

6.90

0.272

1.80

0.071

2220

7.00

0.276

3.30

0.130

5.50

0.217

1.85

0.073

2225

7.00

0.276

3.30

0.130

6.80

0.268

1.85

0.073

L (Pad Length)

Chip Size

T (Total Length)

S (Separation

W (Pad Width)

pF

From -55ºC to +125ºC

CAPACITOR ORDERING INFORMATION

ELECTRICAL PARAMETERS

MARKING

PACKAGING

SOLDERING PROCESS

RECOMMENDED SOLDER PAD DIMENSIONS

Style

Chip Size

Specification

Capacitance Code, pF

Capacitance Tolerance

Voltage

Temperature Characteristic

Failure Rate Level

End Metallization

84