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SA5225 Datasheet(PDF) 7 Page - NXP Semiconductors |
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SA5225 Datasheet(HTML) 7 Page - NXP Semiconductors |
7 / 10 page Philips Semiconductors Product specification SA5225 Fiber optic postamplifier 1998 Oct 07 7 Since Philips Semiconductors has no control of third party procedures in the handling or packaging of die, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems on any die sales. Although Philips Semiconductors typically realizes a yield of 85% after assembling die into their respective packages, with care customers should achieve a similar yield. However, for the reasons stated above, Philips Semiconductors cannot guarantee this or any other yield on any die sales. 1 2 3 4 5 6 78 9 10 11 12 13 14 15 16 CAZN CAZP GNDA DIN DIN VCCA CF JAM ST ST GNDE DOUT VCCE VREF DOUT VSET ECN No.: 01671 1991 Jul 8 SD00493 Figure 8. SA5225 Bonding Diagram |
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