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MPXV5004G Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc

Part No. MPXV5004G
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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Maker  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
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MPXV5004G Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc

 
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Sensors
4
Freescale Semiconductor
MPXV5004G
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number
Case Type
Pressure (P1) Side Identifier
MPXV5004GC6U/T1
482A
Side with Port Attached
MPXV5004G6U/T1
482
Stainless Steel Cap
MPXV5004GC7U
482C
Side with Port Attached
MPXV5004G7U
482B
Stainless Steel Cap
MPXV5004GP
1369
Side with Port Attached
MPXV5004DP
1351
Side with Port Marking
MPXV5004GVP
1368
Stainless Steel Cap
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1


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