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MPX5500 Datasheet(PDF) 3 Page - Freescale Semiconductor, Inc

Part No. MPX5500
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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Maker  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
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MPX5500 Datasheet(HTML) 3 Page - Freescale Semiconductor, Inc

   
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Sensors
Freescale Semiconductor
3
MPX5500
Figure 3 illustrates the Differential/Gauge basic chip
carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor
diaphragm. (For use of the MPX5500D in a high pressure,
cyclic application, consult the factory.)
The MPX5500 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0
° to 85°C using the decoupling circuit shown in Figure 4.
The output will saturate outside of the specified pressure
range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 2. Output versus Pressure Differential
Figure 3. Cross-Sectional Diagrams (not to scale)
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Differential Pressure (kPa)
TYPICAL
MIN
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
50
100 150 200 250
300 350 400
450
550
500
MAX
Transfer Function:
Vout = VS*(0.0018*P+0.04) ± Error
VS = 5.0 Vdc
Temperature = 0 to 85°C
Fluoro Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
RTV Die
Bond
Epoxy Case
P2
+5 V
1.0
µF
0.01
µF
470 pF
GND
Vs
Vout
IPS
Output


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