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MPC8541EVTAKE Datasheet(PDF) 68 Page - Freescale Semiconductor, Inc |
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MPC8541EVTAKE Datasheet(HTML) 68 Page - Freescale Semiconductor, Inc |
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68 / 84 page  MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4 68 Freescale Semiconductor Thermal Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the MPC8541E to function in various environments. 16.2.1 Recommended Thermal Model For system thermal modeling, the MPC8541E thermal model is shown in Figure 42. Five cuboids are used to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block 29x29x1.6 mm with the conductivity adjusted accordingly. The die is modeled as 8.7 x 9.3 mm at a thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed resistance between the die and substrate assuming a conductivity of 4.4 W/m•K in the thickness dimension of 0.07 mm. The lid attach adhesive is also modeled as a collapsed resistance with dimensions of 8.7 x 9.3 x 0.05 mm and the conductivity of 1.07 W/m•K. The nickel plated copper lid is modeled as 11 x 11 x 1 mm. Figure 42. MPC8541E Thermal Model Die Lid Substrate and solder balls Heat Source Substrate Side View of Model (Not to Scale) Top View of Model (Not to Scale) x y z Conductivity Value Unit Lid (11 × 11 × 1 mm) kx 360 W/(m × K) ky 360 kz 360 Lid Adhesive—Collapsed resistance (8.7 × 9.3 × 0.05 mm) kz 1.07 Die (8.7 × 9.3 × 0.75 mm) Bump/Underfill—Collapsed resistance (8.7 × 9.3 × 0.07 mm) kz 4.4 Substrate and Solder Balls (25 × 25 × 1.6 mm) kx 14.2 ky 14.2 kz 1.2 Adhesive Bump/underfill |
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