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PN4392 Datasheet(PDF) 3 Page - NXP Semiconductors |
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PN4392 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 6 page April 1989 3 Philips Semiconductors Product specification N-channel silicon field-effect transistors PN4391 to 4393 THERMAL RESISTANCE STATIC CHARACTERISTICS Tj =25 °C unless otherwise specified From junction to ambient in free air Rth j-a = 350 K/W PN4391 PN4392 PN4393 Reverse gate current −V GS = 20 V; VDS =0 −IGSS max. 1.0 1.0 1.0 nA −VGS = 20 V; VDS =0 Tamb = 100 °C −IGSS max. 200 200 200 nA Drain cut-off current −VGS = 12 V VDS = 20 V IDSX max. 1.0 nA −V GS =7 V IDSX max. 1.0 nA −V GS =5 V IDSX max. 1.0 nA −VGS = 12 V VDS = 20 V; Tamb = 100 °C IDSX max. 200 nA −V GS =7 V IDSX max. 200 nA −V GS =5 V IDSX max. 200 nA Drain saturation current VDS = 20 V; VGS =0 IDSS min. 50 25 5 mA max. 150 100 60 mA Gate-source breakdown voltage −I G =1 µA; VDS =0 −V(BR)GSS min. 40 40 40 V Gate-source cut-off voltage VDS = 20 V; ID =1nA −VGS off min. 4.0 2.0 0.5 V max. 10 5.0 3.0 V Drain-source on-resistance ID = 1 mA; VGS =0 RDS on max. 30 60 100 Ω Drain-source on-voltage VGS = 0; ID = 12 mA VDS on max. 0.4 V VGS = 0; ID = 6 mA VDS on max. 0.4 V VGS = 0; ID = 3 mA VDS on max. 0.4 V |
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