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NSP4R7M16D2TRF Datasheet(PDF) 4 Page - NIC-Components Corp. |
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NSP4R7M16D2TRF Datasheet(HTML) 4 Page - NIC-Components Corp. |
4 / 5 page 67 ® NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com Surface Mount Specialty Polymer Solid Aluminum Electrolytic Capacitors NSP Series PART NUMBERING SYSTEM NSP 101 M 12.5 D2 X TR F RoHS Compliant Tape and Reel High Performance Case Size Working Voltage Tolerance Code M=20%, K=10% Capacitance Code in µF, first 2 digits are significant, third digits no. of zeros Series D2 - D5 and D2X - D5X Sizes Base: Fe (~ 100 µm) Under Plating: Cu (~ 5 µm) Finish Plating: Sn (5 ~ 9 µm) D2Z - D6Z Sizes Base: Cu (~ 105 µm) Finish Plating: Sn (5 ~ 9 µm) TERMINATION MATERIAL: NIC Part Number (Reflow 240°C) NIC Part Number (Reflow 260°C) WV Cap. Max. LC ( µA) Tan δ Max. Ripple Current +105°C & 100KHz (mA) Max. ESR +20°C & 100KHz ( Ω) Height H (Vdc) ( µF) 240°C 260°C NSP4R7M12.5D2TRF N/A 12.5 4.7 3.0 - 0.06 1,000 0.080 1.8±0.1 NSP100M12.5D2TRF N/A 10 5.0 - 0.06 1,000 0.060 1.8±0.1 NSP150M12.5D5TRF N/A 15 7.5 - 0.06 1,400 0.040 1.1±0.1 NSP150M12.5D2TRF N/A 15 7.5 - 0.06 1,300 0.050 1.8±0.1 NSP220M12.5D2TRF N/A 22 11.0 - 0.06 1,600 0.030 1.8±0.1 NSP2R2M16D2TRF N/A 16 2.2 3.0 - 0.06 1,000 0.110 1.8±0.1 NSP4R7M16D2TRF N/A 4.7 3.0 - 0.06 1,000 0.080 1.8±0.1 NSP6R8M16D2TRF N/A 6.8 4.4 - 0.06 1,000 0.070 1.8±0.1 NSP8R2M16D2TRF N/A 8.2 5.2 - 0.06 1,300 0.045 1.8±0.1 RECOMMENDED 240°C REFLOW SOLDERING PROFILE (D2, D2Z, D3, D3X, D3Z, D4, D4X, D4Z, D5, D6Z) 160oC PREHEAT NATURAL COOLING 240oC Max. 250 200 150 100 50 Time above 200°C 120 Seconds 5 Seconds Max. Time (Seconds) RECOMMENDED 260°C REFLOW SOLDERING PROFILE (D2A, D2XA, D2ZA, D3A, D3XA, D3YA, D4A, D4XA, D4YA, D6A, D6ZA) NATURAL COOLING 260oC Max. 5 Seconds Max. 230 Time above 230°C 120 Seconds 150oC ~ 200°C PREHEAT Time (Seconds) If Peak Soldering Temperature is Maximum Time Above +200°C is 240°C 30 seconds 230°C 40 seconds 220°C 50 seconds If Peak Soldering Temperature is Maximum Time Above +230°C is 260°C 40 seconds 255°C 50 seconds 250°C 60 seconds 250 150 200 50 100 DURATION ABOVE 200°C (FOR 240°C REFLOW PARTS) DURATION ABOVE 230°C (FOR 260°C REFLOW PARTS) Notes: 1. SAC alloy (+217°C) reflow soldering compatible 2. Soldering heat limits apply to the top surface of component 3. If you have concerns about your reflow soldering profile review them with NIC to insure compatible [tpmg@niccomp.com] 4. Two passes through the reflow process are allowed (cooling down period between process). |
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