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MAAPGM0053-DIE Datasheet(PDF) 5 Page - Tyco Electronics

Part No. MAAPGM0053-DIE
Description  Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz
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Maker  MACOM [Tyco Electronics]
Homepage  http://www.macom.com
Logo MACOM - Tyco Electronics

MAAPGM0053-DIE Datasheet(HTML) 5 Page - Tyco Electronics

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Amplifier, Distributed Power, 0.5 W
2.0-18.0 GHz
MAAPGM0053-DIE
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
903217 —
Preliminary Information
5
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
100 pF
100 pF
RF
IN
RF
OUT
0.1
μF
V
GG
0.1
μF
V
DD
GND:G
VG
GND:D
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
OUT
VD
GND:D
IN
Assembly and Bonding Diagram


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