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MAAPGM0053-DIE Datasheet(PDF) 5 Page - Tyco Electronics |
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MAAPGM0053-DIE Datasheet(HTML) 5 Page - Tyco Electronics |
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5 / 5 page 
Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz MAAPGM0053-DIE M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 903217 — Preliminary Information 5 Assembly Instructions: Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. Figure 6. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization fixture for CW testing. 100 pF 100 pF RF IN RF OUT 0.1 μF V GG 0.1 μF V DD GND:G VG GND:D GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G OUT VD GND:D IN Assembly and Bonding Diagram |
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