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MAAPGM0053-DIE Datasheet(PDF) 4 Page - Tyco Electronics

Part No. MAAPGM0053-DIE
Description  Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz
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Maker  MACOM [Tyco Electronics]
Homepage  http://www.macom.com
Logo MACOM - Tyco Electronics

MAAPGM0053-DIE Datasheet(HTML) 4 Page - Tyco Electronics

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Amplifier, Distributed Power, 0.5 W
2.0-18.0 GHz
MAAPGM0053-DIE
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
903217 —
Preliminary Information
4
Mechanical Information
Chip Size: 3.000 x 2.000 x 0.075 mm
(
118 x 79 x 3 mils)
Pad
Size (
μm)
RF In and Out
100 x 150
DC Drain Supply Voltage VDD
150 x 150
DC Gate Supply Voltage VGG
150 x 150
Size (mils)
4 x 8
8 x 6
4 x 6
Bond Pad Dimensions
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 7. Die Layout
0.467mm
0
0
1.838mm
0.177mm
1.216mm
GND:G
VG
GND:D
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
G ND:G
GND:G
GND:G
GND:G
OUT
VD
GND:D
IN
2.000mm


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