 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
MAAPGM0053-DIE Datasheet(PDF) 4 Page - Tyco Electronics |
|
||||||||||||||||||||||||||||||
MAAPGM0053-DIE Datasheet(HTML) 4 Page - Tyco Electronics |
|
|
4 / 5 page 
Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz MAAPGM0053-DIE M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 903217 — Preliminary Information 4 Mechanical Information Chip Size: 3.000 x 2.000 x 0.075 mm ( 118 x 79 x 3 mils) Pad Size ( μm) RF In and Out 100 x 150 DC Drain Supply Voltage VDD 150 x 150 DC Gate Supply Voltage VGG 150 x 150 Size (mils) 4 x 8 8 x 6 4 x 6 Bond Pad Dimensions Chip edge to bond pad dimensions are shown to the center of the bond pad. Figure 7. Die Layout 0.467mm 0 0 1.838mm 0.177mm 1.216mm GND:G VG GND:D GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G G ND:G GND:G GND:G GND:G OUT VD GND:D IN 2.000mm |
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
