0.5W X/Ku-Band Power Amplifier

MAAPGM0034-DIE

RO-P-DS-3019 A

6/6

Specifications subject to change without notice.

Email: macom_adbu_ics@tycoelectronics.com

North America: Tel. (800) 366-2266

Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300

Visit www.macom.com for additional data sheets and product information.

Figure 6. Recommended bonding diagram for pedestal mount.

Support circuitry typical of MMIC characterization fixture for CW testing.

Assembly Instructions:

Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.

Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For

DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of

shortest length, although ball bonds are also acceptable.

damage to amplifier.

V

DD

0.1

µF

RF

IN

100 pF

V

GG

0.1

µF

100 pF

RF

OUT