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MAAP-000074-PED000 Datasheet(PDF) 6 Page - Tyco Electronics

Part No. MAAP-000074-PED000
Description  Amplifier, Power, 8W 2.0-8.0 GHz
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Maker  MACOM [Tyco Electronics]
Homepage  http://www.macom.com
Logo MACOM - Tyco Electronics

MAAP-000074-PED000 Datasheet(HTML) 6 Page - Tyco Electronics

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Amplifier, Power, 8W
2.0-8.0 GHz
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.comfor additional data sheets and product information.
6
MAAP-000074-PED000
Rev —
Preliminary Datasheet
Pad
Size (
μm)
RF In and Out
100 x 200
DC Drain Supply Voltage VD1
200 x 150
DC Gate Supply Voltage VG1
150 x 150
Size (mils)
4 x 8
8 x 6
6 x 6
DC Drain Supply Voltage VD2
500 x 200
20 x 8
DC Gate Supply Voltage VG2
150 x 125
6 x 5
Pad No.
1
2
3
4
5
Bond Pad Dimensions
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Mechanical Information
Chip Size: 5.204 x 6.550 x 0.356 mm
(
204 x 258 x 14 mils)
Figure 17. Die Layout


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