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MAAP-000074-PED000 Datasheet(PDF) 6 Page - Tyco Electronics |
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MAAP-000074-PED000 Datasheet(HTML) 6 Page - Tyco Electronics |
6 / 8 page ![]() Amplifier, Power, 8W 2.0-8.0 GHz M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.comfor additional data sheets and product information. 6 MAAP-000074-PED000 Rev — Preliminary Datasheet Pad Size ( μm) RF In and Out 100 x 200 DC Drain Supply Voltage VD1 200 x 150 DC Gate Supply Voltage VG1 150 x 150 Size (mils) 4 x 8 8 x 6 6 x 6 DC Drain Supply Voltage VD2 500 x 200 20 x 8 DC Gate Supply Voltage VG2 150 x 125 6 x 5 Pad No. 1 2 3 4 5 Bond Pad Dimensions Chip edge to bond pad dimensions are shown to the center of the bond pad. Mechanical Information Chip Size: 5.204 x 6.550 x 0.356 mm ( 204 x 258 x 14 mils) Figure 17. Die Layout |