MA08509D_1 datasheet(5/5 Pages) MACOM | Amplifier, Power, 10W 8.5-10.5 GHz

5 / 5 page

Amplifier, Power, 10W

8.5—10.5 GHz

MA08509D

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

Rev A

Preliminary Information

Figure 5. Recommended bonding diagram for pedestal mount.

Support circuitry typical of MMIC characterization fixture for CW testing.

NOTE: Indicated Gate voltage pad (VGG 2) represents the nominal bias

condition. However, the device current can be increased or decreased

as required by bonding to either VGG 1 or VGG 3 (respectively).

Assembly Instructions:

Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less

than 7 minutes. Refer to Application Note AN3017 for more detailed information.

Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge

bond techniques. For DC pad connections, use either ball or wedge bonds. For best

RF performance, use wedge bonds of shortest length, although ball bonds are also

acceptable.

Biasing Note: Must apply negative bias to VGG before applying positive bias to

VDD to prevent damage to amplifier.

100 pF

OUT

0.1

μF

100 pF

0.1

μF

0.1

μF

0.1

μF

0.1

μF

0.1

μF

Assembly and Bonding Diagram

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