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PHW7N60 Datasheet(PDF) 1 Page - NXP Semiconductors |
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PHW7N60 Datasheet(HTML) 1 Page - NXP Semiconductors |
1 / 7 page Philips Semiconductors Product specification PowerMOS transistor PHW7N60 GENERAL DESCRIPTION QUICK REFERENCE DATA N-channel enhancement mode SYMBOL PARAMETER MAX. UNIT field-effect power transistor in a plastic envelope featuring high V DS Drain-source voltage 600 V avalanche energy capability, stable I D Drain current (DC) 7 A off-state characteristics, fast P tot Total power dissipation 147 W switching and high thermal cycling R DS(ON) Drain-source on-state resistance 1.2 Ω performance with low thermal resistance. Intended for use in Switched Mode Power Supplies (SMPS), motor control circuits and general purpose switching applications. PINNING - SOT429 (TO247) PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 gate 2 drain 3 source tab drain LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT I D Continuous drain current T mb = 25 ˚C; V GS = 10 V - 7 A T mb = 100 ˚C; VGS = 10 V - 4.5 A I DM Pulsed drain current T mb = 25 ˚C - 28 A P D Total dissipation T mb = 25 ˚C - 147 W ∆P D/∆Tmb Linear derating factor T mb > 25 ˚C - 1.176 W/K V GS Gate-source voltage - ± 30 V E AS Single pulse avalanche V DD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω; - 570 mJ energy V GS = 10 V I AS Peak avalanche current V DD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω;- 7 A V GS = 10 V T j, Tstg Operating junction and - 55 150 ˚C storage temperature range THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-mb Thermal resistance junction to - - 0.85 K/W mounting base R th j-a Thermal resistance junction to - 45 - K/W ambient 2 3 1 d g s June 1997 1 Rev 1.000 |
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