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PHW7N60 Datasheet(PDF) 1 Page - NXP Semiconductors

Part # PHW7N60
Description  PowerMOS transistor
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PHW7N60 Datasheet(HTML) 1 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
PowerMOS transistor
PHW7N60
GENERAL DESCRIPTION
QUICK REFERENCE DATA
N-channel
enhancement
mode
SYMBOL
PARAMETER
MAX.
UNIT
field-effect power transistor in a
plastic
envelope
featuring
high
V
DS
Drain-source voltage
600
V
avalanche energy capability, stable
I
D
Drain current (DC)
7
A
off-state
characteristics,
fast
P
tot
Total power dissipation
147
W
switching and high thermal cycling
R
DS(ON)
Drain-source on-state resistance
1.2
performance
with
low
thermal
resistance. Intended
for use in
Switched Mode Power Supplies
(SMPS), motor control circuits and
general
purpose
switching
applications.
PINNING - SOT429 (TO247)
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
gate
2
drain
3
source
tab
drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
I
D
Continuous drain current
T
mb =
25 ˚C; V
GS = 10 V
-
7
A
T
mb = 100 ˚C; VGS = 10 V
-
4.5
A
I
DM
Pulsed drain current
T
mb = 25 ˚C
-
28
A
P
D
Total dissipation
T
mb = 25 ˚C
-
147
W
∆P
D/∆Tmb
Linear derating factor
T
mb > 25 ˚C
-
1.176
W/K
V
GS
Gate-source voltage
-
± 30
V
E
AS
Single pulse avalanche
V
DD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω;
-
570
mJ
energy
V
GS = 10 V
I
AS
Peak avalanche current
V
DD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω;-
7
A
V
GS = 10 V
T
j, Tstg
Operating junction and
- 55
150
˚C
storage temperature range
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
R
th j-mb
Thermal resistance junction to
-
-
0.85
K/W
mounting base
R
th j-a
Thermal resistance junction to
-
45
-
K/W
ambient
2
3
1
d
g
s
June 1997
1
Rev 1.000


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