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TSS461C Datasheet(PDF) 6 Page - TEMIC Semiconductors |
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TSS461C Datasheet(HTML) 6 Page - TEMIC Semiconductors |
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6 / 24 page  Qualpack TS80C31X2/C32X2 6 Rev. 2 – January 1999 3.3 Package Technology 3.3.1 SOIC.300 16 leads Package weight 0,43 g Chip separation method Sawing Lead frame Material Cu Thickness 10 mils Size 270*270 mils2 Lead plating Electroplated Sn/Pb 85/15 Die attach Material Silver epoxy Type Ablestick 84-1 LMISR4 Wire bonding Material Gold Diameter 33um Method Thermosonic Molding Material Nitto MP8000AN Flammability rating UL94V-0 Marking Method Printed ink Coding example TEMIC optional special customer marking TSS463 YY MM Dry packing No Tube packed Primary Tube Material Antistatic PVC Number per unit 47 Secondary Box Material Cardboard Number per unit 1692 Labelling (minimum) Device type, Quantity, Date Code, Prod. code Bar coding Code 39 to EIA-556-A |
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