M36P0R9070E0

Package mechanical

19/23

6

Package mechanical

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second-level interconnect. The category of

Second-Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 6.

TFBGA107 8 × 11mm - 9 × 12 active ball array, 0.8mm pitch, package

outline

1.

Drawing is not to scale.

E

D

eb

SE

A2

A1

A

BGA-Z85

ddd

FD

D1

E1

e

FE

BALL "B1"