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TMP411 Datasheet(PDF) 6 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
Part No. TMP411
Description  ±1°C Remote and Local TEMPERATURE SENSOR with N-Factor and Series Resistance Correction
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Maker  BURR-BROWN [Burr-Brown (TI)]
Homepage  http://www.burr-brown.com
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TMP411 Datasheet(HTML) 6 Page - Burr-Brown (TI)

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TMP411
SBOS383A − FEBRUARY 2007
www.ti.com
6
APPLICATIONS INFORMATION
The TMP411 is a dual-channel digital temperature sensor
that combines a local die temperature measurement
channel and a remote junction temperature measurement
channel in a single MSOP-8 or SO-8 package. The
TMP411 is Two-Wire- and SMBus interface-compatible
and is specified over a temperature range of −40
°C to
+125
°C. The TMP411 contains multiple registers for
holding
configuration
information,
temperature
measurement
results,
temperature
comparator
maximum/minimum limits, and status information.
User-programmed high and low temperature limits stored
in the TMP401 can be used to monitor local and remote
temperatures to trigger an over/under temperature alarm
(ALERT). Additional thermal limits can be programmed
into the TMP411 and used to trigger another flag (THERM)
that can be used to initiate a system response to rising
temperatures.
The TMP411 requires only a transistor connected between
D+ and D− for proper remote temperature sensing
operation. The SCL and SDA interface pins require pull-up
resistors as part of the communication bus, while ALERT
and THERM are open-drain outputs that also need pull−up
resistors. ALERT and THERM may be shared with other
devices if desired for a wired-OR implementation. A 0.1
µF
power-supply bypass capacitor is recommended for good
local bypassing. Figure 11 shows a typical configuration
for the TMP411.
0.1
µF
10k
(typ)
10k
(typ)
10k
(typ)
10k
(typ)
TMP411
D+
D
V+
1
8
7
6
4
5
3
2
R
S
(2)
R
S
(2)
C
DIFF
(3)
C
DIFF
(3)
R
S
(2)
R
S
(2)
GND
SCL
SDA
ALERT/THERM2
THERM
+5V
SMBus
Controller
Fan Controller
Diode−connected configuration(1):
Series Resistance
Transistor−connected configuration(1):
(1) Diode−connected configuration provides better settling time.
Transistor−connected configuration provides better series resistance cancellation.
(2) R
S should be < 1.5kΩ in most applications.
(3) C
DIFF should be < 1000pF in most applications.
NOTES:
Figure 11. Basic Connections


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