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H11A817D Datasheet(PDF) 10 Page - Fairchild Semiconductor |
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H11A817D Datasheet(HTML) 10 Page - Fairchild Semiconductor |
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10 / 11 page  10 www.fairchildsemi.com H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8 Lead Free Recommended IR Reflow Condition Recommended Wave Soldering condition Profile Feature Pb-Sn solder assembly Lead Free assembly Preheat condition (Tsmin-Tsmax / ts) 100°C ~ 150°C 60 ~ 120 sec 150°C ~ 200°C 60 ~120 sec Melt soldering zone 183°C 60 ~ 120 sec 217°C 30 ~ 90 sec Peak temperature (Tp) 240 +0/-5°C 260 +0/-5°C Ramp-down rate 6°C/sec max. 6°C/sec max. Profile Feature For all solder assembly Peak temperature (Tp) Max 260°C for 10 sec Time (sec) ts (Preheat) 25 °C Tsmin Tsmax Tp Soldering zon Ramp-down |
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Similar Description - H11A817D |
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