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DEVICE INFORMATION

NC

AV

DD

CLKP

CLKN

AV

DD

YP0

YN0

V

DD

YP1

YN1

V

DD

V

SS

ADD0

V

DD

YN7

YP7

V

DD

YN6

YP6

V

DD

YN5

YP5

V

DD

SDA

1

2

3

4

5

6

7

8

9

10

11

12

36

35

34

33

32

31

30

29

28

27

26

25

CDCL1810

NOTE:Exposedthermalpadmustbesolderedto V

CDCL1810

SLLS781A – FEBRUARY 2007 – REVISED MARCH 2007

48-PIN QFN (RGZ)

(TOP VIEW)

The CDCL1810 is available in a 48-pin QFN (RGZ) package with a pin pitch of 0,5mm. The exposed thermal pad

serves both thermal and electrical grounding purposes.

NOTE:

The device performance will be severely impacted if the exposed thermal pad is not

grounded appropriately.

6

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