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ISL6208CB Datasheet(PDF) 3 Page - Intersil Corporation |
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ISL6208CB Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 10 page 3 FN9115.2 March 30, 2007 ti Absolute Maximum Ratings Thermal Information Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input Voltage (VFCCM, VPWM). . . . . . . . . . . . . -0.3V to VCC + 0.3V BOOT Voltage (VBOOT-GND). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V BOOT To PHASE Voltage (VBOOT-PHASE) . . . . . . -0.3V to 7V (DC) -0.3V to 9V (<10ns) PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V GND - 8V (<20ns Pulse Width, 10 μJ) UGATE Voltage . . . . . . . . . . . . . . . . VPHASE - 0.3V (DC) to VBOOT VPHASE - 5V (<20ns Pulse Width, 10μJ) to VBOOT LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V GND - 2.5V (<20ns Pulse Width, 5 μJ) to VCC + 0.3V Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C Recommended Operating Conditions Ambient Temperature Range . . . . . . . . . . . . . . . . . .-10°C to +100°C Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10% Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) SOIC Package (Note 2) . . . . . . . . . . . . 110 n/a QFN Package (Notes 3, 4). . . . . . . . . . 80 15 Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C (SOIC - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND. 2. θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 4. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS VCC SUPPLY CURRENT Bias Supply Current IVCC PWM pin floating, VFCCM = 5V - 80 - μA POR --- VCC Rising - 3.40 3.90 V VCC Falling 2.40 2.90 - V Hysteresis - 500 - mV BOOTSTRAP DIODE Forward Voltage VF VVCC = 5V, forward bias current = 2mA 0.50 0.55 0.65 V PWM INPUT Input Current IPWM VPWM = 5V - 250 - μA VPWM = 0V - -250 - μA PWM Three-State Rising Threshold VVCC = 5V 0.70 1.00 1.30 V PWM Three-State Falling Threshold VVCC = 5V 3.5 3.8 4.1 V Three-State Shutdown Hold-off Time tTSSHD VVCC = 5V, temperature = +25°C 100 175 250 ns FCCM INPUT FCCM LOW Threshold 0.50 - - V FCCM HIGH Threshold -- 2.0 V SWITCHING TIME UGATE Rise Time (Note 5) tRU VVCC = 5V, 3nF load - 8.0 - ns LGATE Rise Time (Note 5) tRL VVCC = 5V, 3nF load - 8.0 - ns ISL6208 |
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