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ISL6208CB Datasheet(PDF) 3 Page - Intersil Corporation

Part # ISL6208CB
Description  High Voltage Synchronous Rectified Buck MOSFET Driver
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL6208CB Datasheet(HTML) 3 Page - Intersil Corporation

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3
FN9115.2
March 30, 2007
ti
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (VFCCM, VPWM). . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (VBOOT-GND). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT To PHASE Voltage (VBOOT-PHASE) . . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
GND - 8V (<20ns Pulse Width, 10
μJ)
UGATE Voltage . . . . . . . . . . . . . . . . VPHASE - 0.3V (DC) to VBOOT
VPHASE - 5V (<20ns Pulse Width, 10μJ) to VBOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5
μJ) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
Recommended Operating Conditions
Ambient Temperature Range
. . . . . . . . . . . . . . . . . .-10°C to +100°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
±10%
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
SOIC Package (Note 2) . . . . . . . . . . . .
110
n/a
QFN Package (Notes 3, 4). . . . . . . . . .
80
15
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2.
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Recommended Operating Conditions, Unless Otherwise Noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC SUPPLY CURRENT
Bias Supply Current
IVCC
PWM pin floating, VFCCM = 5V
-
80
-
μA
POR
---
VCC Rising
-
3.40
3.90
V
VCC Falling
2.40
2.90
-
V
Hysteresis
-
500
-
mV
BOOTSTRAP DIODE
Forward Voltage
VF
VVCC = 5V, forward bias current = 2mA
0.50
0.55
0.65
V
PWM INPUT
Input Current
IPWM
VPWM = 5V
-
250
-
μA
VPWM = 0V
-
-250
-
μA
PWM Three-State Rising Threshold
VVCC = 5V
0.70
1.00
1.30
V
PWM Three-State Falling Threshold
VVCC = 5V
3.5
3.8
4.1
V
Three-State Shutdown Hold-off Time
tTSSHD
VVCC = 5V, temperature = +25°C
100
175
250
ns
FCCM INPUT
FCCM LOW Threshold
0.50
-
-
V
FCCM HIGH Threshold
--
2.0
V
SWITCHING TIME
UGATE Rise Time (Note 5)
tRU
VVCC = 5V, 3nF load
-
8.0
-
ns
LGATE Rise Time (Note 5)
tRL
VVCC = 5V, 3nF load
-
8.0
-
ns
ISL6208


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