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X9C303V8I Datasheet(PDF) 8 Page - Intersil Corporation |
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X9C303V8I Datasheet(HTML) 8 Page - Intersil Corporation |
8 / 10 page 8 FN8223.1 January 24, 2007 X9C303 Thin Shrink Small Outline Plastic Packages (TSSOP) α INDEX AREA E1 D N 12 3 -B- 0.10(0.004) C A M BS e -A- b M -C- A1 A SEATING PLANE 0.10(0.004) c E 0.25(0.010) B M M L 0.25 0.010 GAUGE PLANE A2 NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AC, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen- sion at maximum material condition. Minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 0.05(0.002) M8.173 8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE PLASTIC PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A - 0.047 - 1.20 - A1 0.002 0.006 0.05 0.15 - A2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.169 0.177 4.30 4.50 4 e 0.026 BSC 0.65 BSC - E 0.246 0.256 6.25 6.50 - L 0.0177 0.0295 0.45 0.75 6 N8 8 7 α 0o 8o 0o 8o - Rev. 1 12/00 |
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