2

FN8157.5

August 31, 2006

Ordering Information

PART NUMBER

PART MARKING

TEMPERATURE

RANGE (°C)

PACKAGE

PKG.

DWG. #

X9015WS8T1

X9015W

5 ±10%

10

0 to +70

8 Ld SOIC

Tape and Reel

M8.15

X9015WS8ZT1 (Note)

X9015W Z

0 to +70

8 Ld SOIC (Pb-free)

Tape and Reel

M8.15

X9015UM8

ABB

50

0 to +70

8 Ld MSOP

M8.118

X9015UM8Z (Note)

DCF

0 to +70

8 Ld MSOP (Pb-free)

M8.118

X9015UM8I*

ABD

-40 to +85

8 Ld MSOP

M8.118

X9015UM8IZ* (Note)

DCD

-40 to +85

8 Ld MSOP (Pb-free)

M8.118

X9015US8*

X9015U

0 to +70

8 Ld SOIC

M8.15

X9015US8Z* (Note)

X9015U Z

0 to +70

8 Ld SOIC (Pb-free)

M8.15

X9015US8I*

X9015U I

-40 to +85

8 Ld SOIC

M8.15

X9015US8IZ* (Note)

X9015U Z I

-40 to +85

8 Ld SOIC (Pb-free)

M8.15

X9015WS8-2.7*

X9015W F

2.7-5.5

10

0 to +70

8 Ld SOIC

M8.15

X9015WS8Z-2.7* (Note)

X9015W ZF

0 to +70

8 Ld SOIC (Pb-free)

M8.15

X9015UM8-2.7*

ABC

50

0 to +70

8 Ld MSOP

M8.118

X9015UM8Z-2.7* (Note)

DCF

0 to +70

8 Ld MSOP (Pb-free)

M8.118

X9015UM8I-2.7*

ABE

-40 to +85

8 Ld MSOP

M8.118

X9015UM8IZ-2.7* (Note)

DCE

-40 to +85

8 Ld MSOP (Pb-free)

M8.118

X9015US8-2.7*

X9015U F

0 to +70

8 Ld SOIC

M8.15

X9015US8Z-2.7* (Note)

X9015U ZF

0 to +70

8 Ld SOIC (Pb-free)

M8.15

X9015US8I-2.7*

X9015U G

-40 to +85

8 Ld SOIC

M8.15

X9015US8IZ-2.7* (Note)

X9015U ZG

-40 to +85

8 Ld SOIC (Pb-free)

M8.15

* Add “T1” suffix for tape and reel.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin

plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are

MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

X9015