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OM3105P Datasheet(PDF) 5 Page - NXP Semiconductors

Part No. OM3105P
Description  Hybrid integrated circuits for inductive proximity detectors
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

OM3105P Datasheet(HTML) 5 Page - NXP Semiconductors

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January 1994
5
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive
proximity detectors
OM3105P
20
80
400
MBD234
0
20
40
60
I
T ( C)
o
s
O max
(mA)
350
300
250
200
150
Fig.4
Overload protection as a function of the substrate temperature.
MOUNTING RECOMMENDATIONS
General
If a protective cap is incorporated, it should be as thin as
possible, because its thickness “d” forms part of the
operating distance “S”.
A brass stud wall should not extend beyond the potcore.
The exact value of “S” with its spread is determined by a
number of variables, e.g.:
value of the adjustment resistor Rx,
the oscillator coil,
the metal of the actuator,
the material and shape of the housing.
Soldering recommendations
• Use normal 60/40 solder.
• Use a soldering iron with a fine point.
• Soldering time should be kept to a minimum, not
exceeding 2.5 s per soldering point (Tsld = 250 °C
maximum).
• The substrate should preferably be pre-heated to a
temperature of 100
°C with a minimum of 80 °C and a
maximum of 125
°C.
Potting recommendations
First cover the hybrid IC with about 0.5 mm of silicone
rubber, let it harden and with the parts inserted in the tube,
fill up the tube with epoxy.
Fig.5 Insertion of potcore in brass tube.
MSB318
d


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