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ISL59118 Datasheet(PDF) 9 Page - Intersil Corporation |
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ISL59118 Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 10 page 9 All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6317.2 September 22, 2006 Power Dissipation With the high output drive capability of the ISL59118, it is possible to exceed the +125°C absolute maximum junction temperature under certain load current conditions. Therefore, it is important to calculate the maximum junction temperature for an application to determine if load conditions or package types need to be modified to assure operation of the amplifier in a safe operating area. The maximum power dissipation allowed in a package is determined according to: Where: TJMAX = Maximum junction temperature TAMAX = Maximum ambient temperature Θ JA = Thermal resistance of the package The maximum power dissipation actually produced by an IC is the total quiescent supply current times the total power supply voltage, plus the power in the IC due to the load, or: for sourcing: for sinking: Where: VS = Supply voltage ISMAX = Maximum quiescent supply current VOUT = Maximum output voltage of the application RLOAD = Load resistance tied to ground ILOAD = Load current Power Supply Bypassing Printed Circuit Board Layout As with any modern operational amplifier, a good printed circuit board layout is necessary for optimum performance. Lead lengths should be as short as possible. The power supply pin must be well bypassed to reduce the risk of oscillation. For normal single supply operation, a single 4.7µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor from VS+ to GND will suffice. Printed Circuit Board Layout For good AC performance, parasitic capacitance should be kept to minimum. Use of wire wound resistors should be avoided because of their additional series inductance. Use of sockets should also be avoided if possible. Sockets add parasitic inductance and capacitance that can result in compromised performance. PD MAX T JMAX T AMAX – Θ JA ---------------------------------------------- = PD MAX V S I SMAX V S V OUT – () + × V OUT R L ---------------- × = PD MAX V S I SMAX V OUT V S – () + × I LOAD × = ISL59118 |
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