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NE556 Datasheet(PDF) 2 Page - NXP Semiconductors

Part No. NE556
Description  Dual timer
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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 2 page
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Philips Semiconductors Linear Products
Product specification
NE/SA/SE556/NE556-1
Dual timer
August 31, 1994
354
EQUIVALENT SCHEMATIC (Shown for one circuit only)
R3
4.7K
CB
Q18
E
R9
5K
R6
100K
VCC
R1
4.7K
R2
330
R4
1K
Q5
Q6 Q7
Q9
Q8
R7
5K
R12
6.8K
Q19
Q21
R13
3.3K
Q22
OUTPUT
Q23
C
B
Q20
R14
220
Q24
Q17
R11
4.7K
R10
3.2
K
Q16
R8
5K
Q15
Q11 Q12
Q10
Q13
R5
10K
R15
4.7K
R16
100
Q25
Q14
Q2 Q3
Q1
Q4
CONTROL VOLTAGE
THRESHOLD
TRIGGER
RESET
DISCHARGE
GND
ORDERING INFORMATION
DESCRIPTION
TEMPERATURE RANGE
ORDER CODE
DWG #
14-Pin Plastic Small Outline (SO) Package
0 to +70
°C
NE556D
0175D
14-Pin Ceramic Dual In-Line Package (CERDIP)
0 to +70
°C
NE556F
0581B
14-Pin Plastic Dual In-Line Package (DIP)
0 to +70
°C
NE556N
0405B
14-Pin Ceramic Dual In-Line Package (CERDIP)
0 to +70
°C
NE556-1F
0581B
14-Pin Plastic Dual In-Line Package (DIP)
0 to +70
°C
NE556-1N
0405B
14-Pin Plastic Dual In-Line Package (DIP)
-40
°C to +85°C
SA556N
0405B
14-Pin Ceramic Dual In-Line Package (CERDIP)
-55
°C to +125°C
SE556F
0581B
14-Pin Plastic Dual In-Line Package (DIP)
-55
°C to +125°C
SE556N
0405B
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
NE/SA556, NE556-1
+16
V
SE556
+18
V
PD
Maximum allowable power dissipation1
800
mW
TA
Operating temperature range
NE556-1, NE556
0 to +70
°C
SA556
-40 to +85
°C
SE556
-55 to +125
°C
TSTG
Storage temperature range
-65 to +150
°C
TSOLD
Lead soldering temperature (10sec max)
+300
°C
NOTES:
1. The junction temperature must be kept below 125
°C for the D package and below 150°C for the N and F packages. At ambient temperatures
above 25
°C, where this limit would be exceeded, the Maximum Allowable Power Dissipation must be derated by the following:
D package 115
°C/W
N package 80
°C/W
F package 100
°C/W




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