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NE555 Datasheet(PDF) 3 Page - NXP Semiconductors

Part No. NE555
Description  Timer
Download  7 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

NE555 Datasheet(HTML) 3 Page - NXP Semiconductors

  NE555 Datasheet HTML 1Page - NXP Semiconductors NE555 Datasheet HTML 2Page - NXP Semiconductors NE555 Datasheet HTML 3Page - NXP Semiconductors NE555 Datasheet HTML 4Page - NXP Semiconductors NE555 Datasheet HTML 5Page - NXP Semiconductors NE555 Datasheet HTML 6Page - NXP Semiconductors NE555 Datasheet HTML 7Page - NXP Semiconductors  
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Philips Semiconductors Linear Products
Product specification
NE/SA/SE555/SE555C
Timer
August 31, 1994
348
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNIT
Supply voltage
VCC
SE555
+18
V
NE555, SE555C, SA555
+16
V
PD
Maximum allowable power dissipation1
600
mW
TA
Operating ambient temperature range
NE555
0 to +70
°C
SA555
-40 to +85
°C
SE555, SE555C
-55 to +125
°C
TSTG
Storage temperature range
-65 to +150
°C
TSOLD
Lead soldering temperature (10sec max)
+300
°C
NOTES:
1. The junction temperature must be kept below 125
°C for the D package and below 150°C for the FE, N and F packages. At ambient tempera-
tures above 25
°C, where this limit would be derated by the following factors:
D package 160
°C/W
FE package 150
°C/W
N package 100
°C/W
F package 105
°C/W


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