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CFK2162-P3

Product Specifications - July 1997

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Celeritek reserves the right to make changes without further notice to any products herein. Celeritek makes no warranty, representation or guarantee regarding the

suitability of its products for any particular purpose, nor does Celeritek assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating

parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Celeritek does not convey any license under its patent

rights nor the rights of others. Celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or

other applications intended to support or sustain life, or for any other application in which the failure of the Celeritek product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Celeritek products for any such unintended or unauthorized application, Buyer shall indemnify and hold Celeritek and

its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,

directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Celeritek was negligent

regarding the design or manufacture of the part. Celeritek is a registered trademark of Celeritek, Inc. Celeritek, Inc. is an Equal Opportunity/Affirmative Action Employer.

Ordering Information

The CFK2162-P3 power stage is available in a SO-8 surface mount package. Devices are available in tape and reel. Ordering part

numbers are listed.

Part Number for Ordering

Function

Package

CFK2162-P3

1.8 - 2.0 GHz Power Stage

SO-8 surface mount power package

CFK2162-P3-000T

1.8 - 2.0 GHz Power Stage

SO-8 surface mount power package in tape and reel

Thermal Considerations

The data shown was taken on a 31 mil thick FR-4 board with 1 ounce copper on both sides. The board was mounted to a base-

plate with 3 screws as shown. The screws bring the top side copper temperature to the same value as the baseplate. The thermal

resistance to the indicated reference lead,

Θ

JL, is 10°C/W. The thermal resistance to the reference screw is 12°C/W.

1. Use 1 or 2 ounce copper if possible.

2. Solder all eight leads of the CFK2162-P3 package to the appropriate electrical connection.

3. Solder the copper pad on the backside of the CFK2162-P3 package to the ground plane.

4. Use a large ground pad area with many plated through-holes as shown.

5. If possible, use at least one screw no more than 0.2 inches from the CFK2162-P3 package to provide a low thermal resistance

path to the baseplate of the package.