HS0-201HSRH-Q datasheet(2/4 Pages) INTERSIL

Part #	HS0-201HSRH-Q

Description	Radiation Hardened High Speed, Quad SPST, CMOS Analog Switch

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Manufacturer	INTERSIL [Intersil Corporation]

Direct Link	http://www.intersil.com/cda/home

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2 / 4 page

2

FN4874.1

March 24, 2006

Die Characteristics

DIE DIMENSIONS

2790

µm x 4950µm (110 mils x 195 mils)

Thickness: 483

µm ±25.4µm (19 mils ±1 mil)

INTERFACE MATERIALS

Glassivation

Type: Phosphorus Silicon Glass (PSG)

Thickness: 8.0k

Å +/-1.0kÅ

Metallization

Type: Ti/AlCu

Thickness: 16.0k

Å +/- 2kÅ

Substrate

Rad Hard Silicon Gate, Dielectric Isolation

Backside Finish

Silicon

ASSEMBLY RELATED INFORMATION

Substrate Potential

Unbiased (DI)

ADDITIONAL INFORMATION

Worst Case Current Density

<2.0 x 105 A/cm2

Transistor Count

328

Metallization Mask Layout

HS-201HSRH

Ordering Information

ORDERING NUMBER

INTERNAL

MKT. NUMBER

PART MARKING

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

5962F9961801VEC

HS1-201HSRH-Q

Q 5962F9961801VEC

-55 to 125

16 Ld SBDIP

D16.3

5962F9961801QEC

HS1-201HSRH-8

Q 5962F9961801QEC

-55 to 125

16 Ld SBDIP

D16.3

5962F9961801VXC

HS9-201HSRH-Q

Q 5962F9961801VXC

-55 to 125

16 Ld Flatpack

K16.A

5962F9961801QXC

HS9-201HSRH-8

Q 5962F9961801QXC

-55 to 125

16 Ld Flatpack

K16.A

5962F9961801V9A

HS0-201HSRH-Q

-

-55 to 125

-

HS1-201HSRH/PROTO

-55 to 125

16 Ld SBDIP

D16.3

HS9-201HSRH/PROTO

-55 to 125

16 Ld Flatpack

K16.A

OUT4

IN4

GND

V-

IN1

A4

A3

A1

A2

OUT3

IN3

V+

IN2

OUT2

OUT1

HS-201HSRH

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HS0-201HSRH-Q Datasheet(PDF) 2 Page - Intersil Corporation

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