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NE1617 Datasheet(PDF) 5 Page - NXP Semiconductors

Part No. NE1617
Description  Temperature monitor for microprocessor systems
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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NE1617 Datasheet(HTML) 5 Page - NXP Semiconductors

 
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Philips Semiconductors
Product specification
NE1617
Temperature monitor for microprocessor systems
1999 Mar 19
5
ELECTRICAL CHARACTERISTICS
VDD = 3.3V; Tamb = 0°C to +125°C unless otherwise noted.
PARAMETER
CONDITIONS
LIMITS
UNIT
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Temperature resolution
1
°C
Local temperature error
Tamb = +60°C to +100°C
<
±1
±2
°C
Local temperature error
Tamb = 0°C to +125°C
<
±2
±3
°C
Remote temperature error
Tremote = +60°C to +100°C
±3
°C
Remote temperature error
Tremote = 0°C to +125°C
±5
°C
Under voltage lockout
VDD supply (Note 1)
2.0
2.95
V
Power-on reset threshold
VDD supply (falling edge) (Note 2)
1.0
2.5
V
Power supply current (average)
Conversion rate = 0.25/sec
70
µA
Power supply current (average)
Conversion rate = 2/sec
180
µA
Power supply current (standby)
SMBus inactive
3
10
µA
Conversion time
From stop bit to conversion complete,
both channels
170
ms
Conversion rate error
Percentage error in programmed rate
–30
+30
%
Remote sensor source current
HIGH level
100
µA
Remote sensor source current
LOW level
10
µA
Address pin bias current
Momentary as the address is being read
(Notes 3 and 4)
160
µA
NOTES:
1. VDD (rising edge) voltage below which the ADC is disabled.
2. VDD (falling edge) voltage below which the logic is reset.
3. Address is read a power up and at start of conversion for all conversions except the fastest rate.
4. Due to the bias current, any pull-up/down resistors should be
≤ 2kΩ.


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