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74LCXH16374 Datasheet(PDF) 1 Page - Fairchild Semiconductor

Part No. 74LCXH16374
Description  Low Voltage 16-Bit D-Type Flip-Flop with Bushold
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

74LCXH16374 Datasheet(HTML) 1 Page - Fairchild Semiconductor

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© 2005 Fairchild Semiconductor Corporation
DS500441
www.fairchildsemi.com
February 2001
Revised June 2005
74LCXH16374
Low Voltage 16-Bit D-Type Flip-Flop with Bushold
General Description
The LCXH16374 contains sixteen non-inverting D-type flip-
flops with 3-STATE outputs and is intended for bus oriented
applications. The device is byte controlled. A buffered clock
(CP) and Output Enable (OE) are common to each byte
and can be shorted together for full 16-bit operation.
The LCXH16374 is designed for low voltage (2.5V or 3.3V)
VCC applications.
The LCXH16374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
The LCXH16374 data inputs include active bushold cir-
cuitry, eliminating the need for external pull-up resistors to
hold unused or floating data inputs at a valid logic level.
Features
s 5V tolerant control inputs and outputs
s 2.3V–3.6V VCC specifications provided
s 6.2 ns tPD max (VCC 3.3V), 20 PA ICC max
s Bushold on inputs eliminating the need for external
pull-up/pull-down resistors
s Power down high impedance outputs
s
r24 mA output drive (VCC 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds 500 mA
s ESD performance:
Human body model
! 2000V
Machine model
! 200V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Note 1: Ordering code “G” indicates Trays.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
GTO
¥ is a trademark of Fairchild Semiconductor Corporation.
Order Number
Package Number
Package Description
74LCXH16374G
(Note 1)(Note 3)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LCXH16374MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCXH16374MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide


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