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DG444DY Datasheet(PDF) 1 Page - Intersil Corporation |
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DG444DY Datasheet(HTML) 1 Page - Intersil Corporation |
1 / 12 page 1 ® FN3586.9 DG444, DG445 Monolithic, Quad SPST, CMOS Analog Switches The DG444 and DG445 monolithic CMOS analog switches are drop-in replacements for the popular DG211 and DG212 series devices. They include four independent single pole single throw (SPST) analog switches and TTL and CMOS compatible digital inputs. These switches feature lower analog ON resistance (<85 Ω) and faster switch time (tON <250ns) compared to the DG211 and DG212. Charge injection has been reduced, simplifying sample and hold applications. The improvements in the DG444 series are made possible by using a high voltage silicon-gate process. An epitaxial layer prevents the latch-up associated with older CMOS technologies. The 44V maximum voltage range permits controlling ±20V signals when operating with ±20V power supplies. The four switches are bilateral, equally matched for AC or bidirectional signals. The ON resistance variation with analog signals is quite low over a ±5V analog input range. The switches in the DG444 and DG445 are identical, differing only in the polarity of the selection logic. Pinout DG444, DG445 (16 LD SOIC, TSSOP) TOP VIEW Features • ON Resistance (Max) . . . . . . . . . . . . . . . . . . . . . . . . . 85 Ω • Low Power Consumption (PD) . . . . . . . . . . . . . . . <35μW • Fast Switching Action -tON (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns -tOFF (Max, DG444) . . . . . . . . . . . . . . . . . . . . . . . 140ns • Low Charge Injection • Upgrade from DG211, DG212 • TTL, CMOS Compatible • Single or Split Supply Operation • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Audio Switching • Battery Operated Systems • Data Acquisition • Hi-Rel Systems • Sample and Hold Circuits • Communication Systems • Automatic Test Equipment 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 IN1 D1 S1 V- GND S4 IN4 D4 IN2 S2 V+ VL S3 D3 IN3 D2 Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # DG444DY* DG444DY -40 to 85 16 Ld SOIC M16.15 DG444DYZ* (Note) DG444DYZ -40 to 85 16 Ld SOIC (Pb-free) M16.15 DG444DVZ* (Note) DG444DVZ -40 to 85 16 Ld TSSOP (Pb-free) M16.173 DG445DY* DG445DY -40 to 85 16 Ld SOIC M16.15 DG445DYZ* (Note) DG445DYZ -40 to 85 16 Ld SOIC (Pb-free) M16.15 DG445DVZ* (Note) DG445DVZ -40 to 85 16 Ld TSSOP (Pb-free) M16.173 *Add “-T” suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Data Sheet November 20, 2006 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 1999, 2003, 2004, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. |
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