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B320 Datasheet(PDF) 1 Page - Diodes Incorporated |
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B320 Datasheet(HTML) 1 Page - Diodes Incorporated |
1 / 3 page ![]() B320 - B360 3.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features • Guard Ring Die Construction for Transient Protection • Ideally Suited for Automatic Assembly • Low Power Loss, High Efficiency • Surge Overload Rating to 125A Peak • For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application • Lead Free Finish/RoHS Compliant (Note 4) Mechanical Data • Case: SMC • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 • Polarity: Cathode Band • Marking Information: See Page 3 • Ordering Information: See Page 3 • Weight: 0.21 grams (approximate) SMC Dim Min Max A 5.59 6.22 B 6.60 7.11 C 2.75 3.18 D 0.15 0.31 E 7.75 8.13 G 0.10 0.20 H 0.76 1.52 J 2.00 2.62 All Dimensions in mm * Note: Device may have a semicircular indentation/notch on one side of the device (as shown). Maximum Ratings and Electrical Characteristics @T A = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol B320 B330 B340 B350 B360 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 20 30 40 50 60 V RMS Reverse Voltage VR(RMS) 14 21 28 35 42 V Average Rectified Output Current @ TT =100C° IO 3.0 A Non-Repetitive Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load IFSM 125 A Forward Voltage (Note 3) @ IF = 3.0A VFM 0.50 0.70 V Peak Reverse Current @ TA = 25°C at Rated DC Blocking Voltage (Note 3) @ TA = 100°C IRM 0.5 20 mA Typical Capacitance (Note 2) CT 200 pF Typical Thermal Resistance, Junction to Terminal RθJT 20 °C/W Typical Thermal Resistance, Junction to Ambient (Note 1) RθJA 90 °C/W Operating Temperature Range Tj -55 to +125 °C Storage Temperature Range TSTG -55 to +150 °C Notes: 1. Thermal Resistance: Junction to terminal, unit mounted on glass epoxy substrate with 2x3mm copper pad 2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. 3. Short duration test pulse used to minimize self-heating effect. 4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7. DS30923 Rev. 2 - 2 1 of 3 www.diodes.com B320-B360 © Diodes Incorporated SPICE MODELS: B320 B330 B340 B350 B360 |