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SD103ASDM Datasheet(PDF) 1 Page - Diodes Incorporated

Part No. SD103ASDM
Description  SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
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Maker  DIODES [Diodes Incorporated]
Homepage  http://www.diodes.com
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SD103ASDM Datasheet(HTML) 1 Page - Diodes Incorporated

   
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Lead-free Green
DS30294 Rev. 7 - 2
1 of 3
SD103ASDM
www.diodes.com
ã Diodes Incorporated
SD103ASDM
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Features
A
M
J
L
D
F
B C
H
K
TOP VIEW
·
Low Forward Voltage Drop
·
Guard Ring Construction for Transient Protection
·
Fast Switching
·
Low Reverse Capacitance
·
Lead Free/RoHS Compliant (Note 3)
·
"Green" Device, Note 4 and 5
·
Case: SOT-26
·
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
·
Moisture Sensitivity: Level 1 per J-STD-020C
·
Polarity: See Diagram
·
Leads: Solderable per MIL-STD-202, Method 208
·
Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
·
Marking: KSU (See Page 3)
·
Weight: 0.016 grams (approximate)
Mechanical Data
Maximum Ratings @ TA = 25°C unless otherwise specified
Electrical Characteristics @ TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40
V
RMS Reverse Voltage
VR(RMS)
28
V
Forward Continuous Current (Note 1)
IFM
350
mA
Non-Repetitive Peak Forward Surge Current
@ t
£ 1.0s
IFSM
1.5
A
Power Dissipation (Note 1)
Pd
225
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
RqJA
444
°C/W
Operating and Storage Temperature Range
Tj,TSTG
-65 to +125
°C
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V(BR)R
40
¾¾
V
IR = 100
mA
Forward Voltage Drop
VF
¾¾
0.37
0.50
0.60
V
IF = 20mA
IF = 100mA
IF = 200mA
Reverse Current (Note 2)
IR
¾¾
5.0
mA
VR = 30V
Total Capacitance
CT
¾
50
¾
pF
VR = 0V, f = 1.0MHz
Reverse Recovery Time
trr
¾
10
¾
ns
IF = IR = 200mA,
Irr = 0.1 x IR,RL = 100
W
SOT-26
Dim
Min
Max
Typ
A
0.35
0.50
0.38
B
1.50
1.70
1.60
C
2.70
3.00
2.80
D
¾¾
0.95
F
¾¾
0.55
H
2.90
3.10
3.00
J
0.013 0.10
0.05
K
1.00
1.30
1.10
L
0.35
0.55
0.40
M
0.10
0.20
0.15
a
0
°
8
°¾
All Dimensions in mm
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
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