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SLVU2.8-4 Datasheet(PDF) 4 Page - Protek Devices |
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SLVU2.8-4 Datasheet(HTML) 4 Page - Protek Devices |
4 / 5 page 4 www.protekdevices.com 05142.R10 4/05 SLVU2.8-4 APPLICATION NOTE Electronic equipment is susceptible to damage caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and tertiary lightning effects. Knowing that equipment can be damaged, the SLVU2.8-4 was designed to provide the level of protection required to safe guard sensitive equipment. This product can be used in different configurations to provide a level of protection to meet unidirectional line requirements as well as bidirectional requirements either in a common-mode or differential-mode configuration. UNIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1) The SLVU2.8-4 provides up to four lines of protection in a common-mode configuration as depicted in figure 1. Circuit connectivity is as follows: ✔ Line 1 is connected to Pin 1 ✔ Line 2 is connected to Pin 7 ✔ Line 3 is connected to Pin 3 ✔ Line 4 is connected to Pin 5 ✔ Pins 2, 4, 7 and 8 are connected to ground BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 2) The SLVU2.8-4 provides up to two lines of protection in a common-mode configuration as depicted in figure 1. Circuit connectivity is as follows: ✔ Line 1 is connected to Pins 1 & 8 ✔ Line 2 is connected to Pins 4 & 5 ✔ Pins 2, 3, 6, and 7 are connected to ground BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 3) The SLVU2.8-4 provides up to two-line pairs of protection in a differenital-mode configuration as depicted in figure 1. Circuit connectivity is as follows: ✔ Line Pair 1 is connected to Pins 1 & 2 ✔ Line Pair 1 is connected to Pins 7 & 8 ✔ Line Pair 2 is connected to Pins 3 & 4 ✔ Line Pair 2 is connected to Pins 5 & 6 CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: ✔ The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. ✔ The path length between the TVS device and the protected line should be minimized. ✔ All conductive loops including power and ground loops should be minimized. ✔ The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. ✔ Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. Figure 2. Bidirectional Common-Mode Protection Figure 1. Unidirectional Common-Mode Protection External diode to ground is a low capacitance diode of less than 10pF Figure 3. Bidirectional Differential-Mode Protection |
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