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PA2423U-EK1 Datasheet(PDF) 6 Page - SiGe Semiconductor, Inc.

Part No. PA2423U-EK1
Description  RangeChargerTM 2.4 GHz BluetoothTM Power Amplifier Evaluation Kit
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Maker  SIGE [SiGe Semiconductor, Inc.]
Homepage  http://www.sige.com
Logo SIGE - SiGe Semiconductor, Inc.

PA2423U-EK1 Datasheet(HTML) 6 Page - SiGe Semiconductor, Inc.

  PA2423U-EK1 Datasheet HTML 1Page - SiGe Semiconductor, Inc. PA2423U-EK1 Datasheet HTML 2Page - SiGe Semiconductor, Inc. PA2423U-EK1 Datasheet HTML 3Page - SiGe Semiconductor, Inc. PA2423U-EK1 Datasheet HTML 4Page - SiGe Semiconductor, Inc. PA2423U-EK1 Datasheet HTML 5Page - SiGe Semiconductor, Inc. PA2423U-EK1 Datasheet HTML 6Page - SiGe Semiconductor, Inc. PA2423U-EK1 Datasheet HTML 7Page - SiGe Semiconductor, Inc. PA2423U-EK1 Datasheet HTML 8Page - SiGe Semiconductor, Inc.  
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PA2423U-EK1
RangeCharger
TM 2.4 GHz BluetoothTM Power Amplifier Evaluation Kit
131-DST-02
Rev 1.3
Apr-19-2006
Confidential
6 of 8
QA041906
Layout Recommendations
Optimum layout of the application board is critical; the input and output matching networks are layout dependent and
will affect gain, output power, power added efficiency, current consumption and harmonics generation. The
connectors do form part of the input and output network. The routing to Vcc1 forms the interstage match for the
power amplifier.
As a reference design, the evaluation board has been optimized from a component and layout perspective to
maximize the performance of the PA2423U. Based on the schematic, the layout of the evaluation board is shown in
Figure 5. This information is also available as gerber files, for ease of use.
Care should be taken to avoid routing the RF output track next to Vcc1 as this provides feedback around the output
stage resulting in a loss in performance. The exposed pad at the bottom of the package is the ground connection for
the IC. The ground vias should be placed as close as possible to this pad. All VCC lines should be well decoupled
keeping the ground end of the decoupling capacitors as short as possible. The decoupling should avoid a ground
return loop to the IC ground.


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