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HI-1575 Datasheet(PDF) 10 Page - Holt Integrated Circuits |
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HI-1575 Datasheet(HTML) 10 Page - Holt Integrated Circuits |
10 / 12 page HOLT INTEGRATED CIRCUITS 10 HI -1575 TRANSMITTER BUSA/B BUSA/B 52.5 (.75 Zo) W 52.5 (.75 Zo) W 2.5:1 1:2.5 1:1.4 1.4:1 35 (.5 Zo) W FIGURE 13. TRANSFORMER COUPLED TEST CIRCUITS Coupling Transformer Coupling Transformer Isolation Transformer Isolation Transformer HI-1575 RECEIVER 52.5 (.75 Zo) W 52.5 (.75 Zo) W 35 (.5 Zo) W Point “A ” T Point “A ” T APPLICATIONS NOTE Holt Applications Note AN-500 provides circuit design notes regarding the use of Holt MIL-STD-1553 data communications devices. Layout considerations, as well as recommended interface and protection components are included. HEAT SINKING THE LEADLESS PLASTIC CHIP CARRIER PACKAGE The HI-1575PCI/T is packaged in a 40 pin leadless plastic chip carrier (LPCC). This package has a metal heat sink pad on its bottom surface, which should be soldered to the printed circuit board for optimum thermal dissipation. The package heat sink is electrically isolated and may be soldered to any convenient power plane or ground plane. Redundant "vias" between the exposed board surface and buried power or ground plane will enhance thermal conductivity. HI-1575 |
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