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ICL7663S Datasheet(PDF) 2 Page - Intersil Corporation |
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ICL7663S Datasheet(HTML) 2 Page - Intersil Corporation |
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2 FN3180.5 July 21, 2005 Ordering Information PART NUMBER TEMP. RANGE (°C) PACKAGE PKG. DWG. # ICL7663SCBA* 0 to 70 8 Ld SOIC (N) M8.15 ICL7663SCBAZA* (See Note) 0 to 70 8 Ld SOIC (N) (Pb-free) M8.15 ICL7663SCPA 0 to 70 8 Ld PDIP E8.3 ICL7663SCPAZ (See Note) 0 to 70 8 Ld PDIP** (Pb-free) E8.3 ICL7663SACBA* 0 to 70 8 Ld SOIC (N) M8.15 ICL7663SACBAZA* (See Note) 0 to 70 8 Ld SOIC (N) (Pb-free) M8.15 ICL7663SACPA 0 to 70 8 Ld PDIP E8.3 ICL7663SAIBA -25 to 85 8 Ld SOIC (N) M8.15 ICL7663SAIBAZA (See Note) -25 to 85 8 Ld SOIC (N) (Pb-free) M8.15 *Add “-T” suffix to part number for tape and reel packaging. **Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. ICL7663S |
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