4

05156.R6 2/07

www.protekdevices.com

*U.S. Patent No. Des. “D456,367S”

P0408FC3.3C*

thru

P0408FC36C*

APPLICATION INFORMATION

Ramp-up

Ramp-down

Ramp-up

15 seconds

Solder Time

15-20 seconds

Ramp-down

T

T

SMAX

T

SMIN

T

L

t 25°C to Peak

30-60 seconds

T

P

155°

140°

0.275mm

Round

Non-Solder Mask Defined Pads

0.325mm Round

0.150mm

0.330mm Round

No Clean

OSP(Entek Cu Plus 106A)

±50µm

±20µm

60 Seconds

270°C

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Paste Type

Pad Protective Finish

Tolerance - Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183°C)

Soldering Maximum Temperature

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

REQUIREMENTS

Temperature:

T

260-270°C

T

Preheat time and temperature depends on solder paste and flux

activation temperature, component size, weight, surface area &

plating.

RECOMMENDED NON-SOLDER MASK

DEFINED PAD ILLUSTRATION

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.