Electronic Components Datasheet Search
  English  ▼

Delete All
ON OFF
ALLDATASHEET.COM

X  

Preview PDF Download HTML

FMS2028 Datasheet(PDF) 5 Page - Filtronic Compound Semiconductors

Part No. FMS2028
Description  SP6T GaAs Multi-Band GSM Antenna Switch
Download  5 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  FILTRONIC [Filtronic Compound Semiconductors]
Homepage  http://www.filtronic.co.uk/
Logo 

FMS2028 Datasheet(HTML) 5 Page - Filtronic Compound Semiconductors

   
Zoom Inzoom in Zoom Outzoom out
 5 / 5 page
background image
5
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
Preliminary Datasheet v2.1
FMS2028
PREFERRED ASSEMBLY INSTRUCTIONS:
HANDLING PRECAUTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
To avoid damage to
the
devices
care
should
be
exercised
during
handling.
Proper
Electrostatic
Discharge
(ESD)
precautions should be observed at all stages
of storage, handling, assembly, and testing.
These devices should be treated as Class 1A
(0-500 V) as defined in JEDEC Standard No.
22-A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
The back of the die is not metallised and the
recommended mounting method is by the use
of conductive epoxy. Epoxy is should be
applied to the attachment surface uniformly
and sparingly to avoid encroachment of epoxy
on to the top face of the die and ideally should
not
exceed
half
the
chip
height.
For
automated
dispense
Ablestick
LMISR4
is
recommended
and
for
manual
dispense
Ablestick
84-1
LMI
or
84-1
LMIT
are
recommended.
These should be cured at a
temperature of 150
°C for 1 hour in an oven
especially set aside for epoxy curing only. If
possible the curing oven should be flushed
with dry nitrogen.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters,
noise
data
and
large-signal
models are available on the Filtronic web site.
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4
µm diameter gold wire
is used. Thermosonic ball bonding is preferred.
A nominal stage temperature of 150
°C and a
bonding force of 40g has been shown to give
effective results for 25
µm wire.
Ultrasonic
energy shall be kept to a minimum. For this
bonding technique, stage temperature should
not be raised above 200°C and bond force
should not be raised above 60g. Thermosonic
wedge
bonding
and
thermocompression
wedge bonding can also be used to achieve
good wire bonds.
DISCLAIMERS:
This product is not designed for use in any
space
based
or
life
sustaining/supporting
equipment.
ORDERING INFORMATION:
PART NUMBER
DESCRIPTION
FMS2028-000-FF
Wafer mounted on film frame
FMS2028-000-WP
Die in Waffle-pack
(Gel-pak available on request)
FMS2028-000-EB
Die mounted on evaluation board
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.


Html Pages

1  2  3  4  5 


Datasheet Download




Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Alldatasheet API   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn