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HA-4741 Datasheet(PDF) 6 Page - Intersil Corporation |
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HA-4741 Datasheet(HTML) 6 Page - Intersil Corporation |
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6 / 8 page  6 Die Characteristics DIE DIMENSIONS: 87 mils x 75 mils x 19 mils 2210 µm x 1910µm x 483µm METALLIZATION: Type: Al, 1% Cu Thickness: 16k Å ±2kÅ PASSIVATION: Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.) Silox Thickness: 12k Å ±2kÅ Nitride Thickness: 3.5k Å ±1.5kÅ SUBSTRATE POTENTIAL (POWERED UP): V- TRANSISTOR COUNT: 72 PROCESS: Junction Isolated Bipolar/JFET Metallization Mask Layout HA-4741 -IN4 +IN4 V- +IN3 -IN3 OUT3 OUT2 -IN2 +IN2 V+ +IN1 -IN1 OUT1 OUT4 HA-4741 |
Similar Part No. - HA-4741_04 |
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Similar Description - HA-4741_04 |
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