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SGB-2433Z Datasheet(PDF) 2 Page - SIRENZA MICRODEVICES |
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SGB-2433Z Datasheet(HTML) 2 Page - SIRENZA MICRODEVICES |
2 / 6 page 303 South Technology Court, Broomfield, CO 80021 Phone: (800) SMI-MMIC http://www.sirenza.com 2 EDS-103083 Rev G Preliminary Data Sheet SGB-2433 DC-4GHz Active Bias Gain Block Simplified Device Schematic 16 1 4 58 9 12 13 15 14 2 3 11 10 67 Active Bias Absolute Maximum Ratings Parameters Value Unit Current (Ic total) 60 mA Device Voltage (VD)5 V Power Dissipation 0.2 W Operating Lead Temperature (TL) -40 to +85 ºC RF Input Power 20 dBm Storage Temperature Range -40 to +150 ºC Operating Junction Temperature (TJ) +150 ºC Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation the device voltage and current must not exceed the maximum operating values specified in the table on page one. Bias conditions should also satisfy the following expression: IDVD < (TJ - TL) / RTH’ j-l Detailed Performance Table: Vcc=3V, Ic=25mA, T=25C, Z=50ohms Symbol Parameter Units 100MHz 500MHz 850MHz 1950MHz 2400MHz 3500MHz G Small Signal Gain dB 19.7 19.5 19.1 17.2 16.2 14.0 OIP3 Output 3rd Order Intercept Point dBm 20.0 19.5 18.0 18.0 P1dB Output Power at 1dB Compression dBm 8.3 7.7 6.9 6.2 IRL Input Return Loss dB 25.0 19.9 17.1 13.4 12.7 10.5 ORL Output Return Loss dB 20.5 18.9 17.1 13.6 13.1 13.0 S12 Reverse Isolation dB 22.4 22.6 22.9 23.7 23.9 24.5 NF Noise Figure dB 3.8 3.2 3.2 3.5 3.9 4.3 Pin Out Description Pin # Function Description 1,2,4, 6, 7,8,11, 12,14 NC These are no connect pins. Leave them unconnected on the PC board. 3 RFIN RF input pin. A DC voltage should not be connected externally to this pin 5 GND An extra ground pin that is connected to the backside exposed paddle. Connection is optional. 10 RFOUT RF Output pin. Bias is applied to the Darlington stage thru this pin. 13 VBIAS This pin sources the current from the active bias circuit. Connect to pin 10 thru an inductor choke. 16 VCC This is Vcc for the active bias circuit. Back- side GND The backside exposed paddle is the main electrical GND and requires multiple vias in the PC board to GND. It is also the main thermal path. Caution: ESD Sensitive Appropriate precaution in handling, packaging and testing devices must be observed. |
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