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MGFC4419G Datasheet(PDF) 4 Page - Mitsubishi Electric Semiconductor

Part No. MGFC4419G
Description  InGaAs HEMT Chip
Download  5 Pages
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Maker  MITSUBISHI [Mitsubishi Electric Semiconductor]
Homepage  http://www.mitsubishichips.com

MGFC4419G Datasheet(HTML) 4 Page - Mitsubishi Electric Semiconductor

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InGaAs HEMT Chip
Notice : This is not a final specification
Some parametric limits are subject to change.
1. Characteristics and quality assurance
1.1 Electrical characteristics
a. DC characteristics on spec. sheet show the test conditions and values using wafer-prober. DC characteristics
are tested 100% devices.
b. RF characteristics are tested using the corresponding packaged FET. When more than 80% 0f the samples
satisfy the value of RF characteristics on spec. sheet , that wafer is accepted for shipment.
1.2 Quality assurance and reliability
a. Mechanical characteristics are tested using corresponding package with sampling test.
b. Visual inspection is complied with MITSUBISHI's technical note.
c. The electrical characteristics and the quality assurance test are sampling test. And so the shipped chips are
contained some sub-standard articles.
d. After opening the packing , the quality of chips are influenced with storage conditions. Our recommended
storage conditions and period is as follows:
Ta=25±3 deg.C
MITSUBISHI's packing + Desiccator
6 months
Opened packing + Desiccator
2 months
In the desiccator , leave the chips in the pack keeping up-side-up and store in a clean and dry enviroment ,
preferable dry N2.
e. Packing quantity
Standard : 400 pcs. or 50 pcs. / each waffle pack
Custom order : 25~400 pcs. / each waffle pack
by 25 pcs. step
In case of long storage exceeding 2 months at customer after opening the packing , total quantity of order
shall be separated and small unit quantity of each orders shall be custome ordered. In this case , we may
prepare special spec. No. for each customer. (ex . -21,-22 )
1.3 Others
The device shall not be returned in the following case.
a. Inadequate storage
b. Mishandling
c. Incorrect die/wire bonding
d. RF characteristics failure rate less than 30%.
2. Ordering information
The classification with Visual grade & packing quantity
is listed in Table.1.
Spec.No. Visual Grade Unit quantity for
each waffle packe
400 pcs
25 pcs
Table.1. Standard specifications
as of Jan.'98

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