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SN74AUC1G125 Datasheet(PDF) 1 Page - Texas Instruments

Part No. SN74AUC1G125
Description  SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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SN74AUC1G125 Datasheet(HTML) 1 Page - Texas Instruments

 
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FEATURES
V
CC
V
CC
3
2
4
5
1
OE
Y
A
GND
DBVPACKAGE
(TOP VIEW)
3
2
4
5
1
OE
V
CC
Y
A
GND
OE
GND
Y
A
Seemechanicaldrawingsfordimensions.
1
4
2
3
5
DCKPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
DRY PACKAGE
(TOP VIEW)
A
NC
OE
6
5
4
2
3
GND
Y
V
CC
1
PR
EVIE
W
NC – Nointernalconnection
DESCRIPTION/ORDERING INFORMATION
SN74AUC1G125
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
SCES382K – MARCH 2002 – REVISED APRIL 2007
• Available in the Texas Instruments
• Low Power Consumption, 10-µA Max I
CC
NanoFree™ Package
• ±8-mA Output Drive at 1.8 V
• Optimized for 1.8-V Operation and Is 3.6-V I/O
• Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
• ESD Protection Exceeds JESD 22
• I
off Supports Partial-Power-Down Mode
2000-V Human-Body Model (A114-A)
Operation
200-V Machine Model (A115-A)
• Sub-1-V Operable
1000-V Charged-Device Model (C101)
• Max t
pd of 2.5 ns at 1.8 V
This bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC1G125 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74AUC1G125YZPR
_ _ _UM_
0.23-mm Large Bump – YZP (Pb-free)
SON – DRY
Reel of 5000
SN74AUC1G125DRYR
PREVIEW
–40
°C to 85°C
SOT (SOT-23) – DBV
Reel of 3000
SN74AUC1G125DBVR
U25_
SOT (SC-70) – DCK
Reel of 3000
SN74AUC1G125DCKR
UM_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3)
DBV/DCK/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
UNLESS
OTHERWISE
NOTED
this
document
contains
Copyright © 2002–2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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