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AOP605 Datasheet(PDF) 3 Page - Alpha & Omega Semiconductors |
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AOP605 Datasheet(HTML) 3 Page - Alpha & Omega Semiconductors |
3 / 5 page 3 II. Die / Package Information: AOP605 AOP605L (Green Compound) Process Standard sub-micron Standard sub-micron low voltage complementary process Package Type 8 lead PDIP 8 lead PDIP Lead Frame Copper with Solder Plate Copper with Solder Plate Die Attach Silver epoxy Silver epoxy Bond wire 2 mils Au wire 2 mils Au wire Mold Material Epoxy resin with silica filler Epoxy resin with silica filler Filler % (Spherical/Flake) 90/10 100/0 Flammability Rating UL-94 V-0 UL-94 V-0 Backside Metallization Ti / Ni / Ag Ti / Ni / Ag Moisture Level Up to Level 1 * Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AOP605 (Standard) & AOP605L (Green) Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@250°c Green: 168hr 85°c /85%RH +3 cycle reflow@250°c 0hr Standard: 11 lots Green: 4 lots 2365 pcs 0 HTGB Temp = 150°c, Vgs=100% of Vgsmax 168 / 500 hrs 1000 hrs 6 lots (Note A*) 492 pcs 77+5 pcs / lot 0 HTRB Temp = 150°c, Vds=80% of Vdsmax 168 / 500 hrs 1000 hrs 6 lots (Note A*) 492 pcs 77+5 pcs / lot 0 HAST 130 +/- 2°c, 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs Standard: 11 lots Green: 4 lots (Note B**) 825 pcs 50+5 pcs / lot 0 Pressure Pot 121°c, 15+/-1 PSIG, RH=100% 96 hrs Standard: 11 lots Green: 3 lots (Note B**) 770 pcs 50+5 pcs / lot 0 Temperature Cycle -65°c to 150 °c, air to air 250 / 500 cycles Standard: 11 lots Green: 3 lots (Note B**) 770 pcs 50+5 pcs / lot 0 DPA Internal Vision Cross-section X-ray NA 5 5 5 5 5 5 0 CSAM NA 5 5 0 |
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