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FBL22033 Datasheet(PDF) 3 Page - NXP Semiconductors

Part No. FBL22033
Description  3.3V BTL 8-bit latched/registered/pass-thru Futurebus universal interface transceiver
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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FBL22033 Datasheet(HTML) 3 Page - NXP Semiconductors

 
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Philips Semiconductors
Product specification
FBL22033
3.3V BTL 8-bit latched/registered/pass-thru
universal transceiver with 30
Ω termination
1999 Apr 15
3
PIN CONFIGURATION
52 51 50 49 48 47 46
45 44 43 42 41 40
39
38
37
36
35
34
33
32
31
30
29
28
27
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19
20
21 22 23 24 25 26
BUS GND
B1
BUS GND
B2
BUS GND
B3
BUS GND
B4
BUS GND
B5
BUS GND
B6
BUS GND
LOGIC GND
AO1
AO2
AO3
LOOPBACK
AI4
AI5
8-Bit Universal Transceiver
FBL22033
52-lead PQFP
AI2
AI3
AO4
AI6
LOGIC GND
AO5
SG00092
DESCRIPTION
The FBL22033 is an 8-bit transceiver featuring a split input (AI) and
output (AO) bus on the TTL-level side.
The common I/O, open collector B port operates at BTL signal
levels. The logic element for data flow in each direction is controlled
by two pairs of mode select inputs (SBA0 and SBA1 for B-to-A,
SAB0 and SAB1 for A-to-B). It can be configured as a buffer, a
register, or a D-type latch.
When configured in the buffer mode, the inverse of the input data
appears at the output port. In the flip-flop mode, data is stored on
the rising edge of the appropriate clock input (LCAB or LCBA). In the
latch mode, clock pins serve as transparent-High latch enables.
Regardless of the mode, data is inverted from input to output.
Data flow in the B-to-A direction, regardless of the logic element
selected, is further controlled by the Loopback input. When the
Loopback input is High the output of the selected A-to-B logic
element (not inverted) becomes the B-to-A input.
The 3-State AO port is enabled by asserting a High level on OEA.
The B port has two output enables, OEB0 and OEB1. Only when
OEB0 is High and OEB1 is Low is the output enabled. When either
OEB0 is Low or OEB1 is High, the B-port is inactive and is pulled to
the level of the pull-up voltage. New data can be entered in the
flip-flop and latched modes or can be retained while the associated
outputs are in 3-State (AO port) or inactive (B port).
The B-port drivers are Low-capacitance open collectors with
controlled ramp and are designed to sink 100mA. Precision band
gap references on the B-port ensure very good noise margins by
limiting the switching threshold to a narrow region centered at 1.55V.
The B-port interfaces to “Backplane Transceiver Logic” (see the
IEEE 1194.1 BTL standard). BTL features low power consumption
by reducing voltage swing (1V p-p, between 1V and 2V) and
reduced capacitive loading by placing an internal series diode on the
drivers. BTL also provides incident wave switching, a necessity for
high performance backplanes.
Output clamps are provided on the BTL outputs to further reduce
switching noise. The “VOH” clamp reduces inductive ringing effects
during a Low-to-High transition. The “VOH” clamp is always active.
The other clamp, the “trapped reflection” clamp, clamps out ringing
below the BTL 0.5V VOL level. This clamp remains active for
approximately 100ns after a High-to-Low transition.
To support live insertion, OEB0 is held Low during power on/off
cycles to ensure glitch- free B port drivers. Proper bias for B port
drivers during live insertion is provided by the BIAS V pin when at a
3.3V level while VCC is Low. The BIAS V pin is a low current input
which will reverse-bias the BTL driver series Schottky diode, and
also bias the B port output pins to a voltage between 1.62V and
2.1V. This bias function is in accordance with IEEE BTL Standard
1194.1. If live insertion is not a requirement, the BIAS V pin should
be tied to a VCC pin.
The LOGIC GND and BUS GND pins are isolated inside the
package to minimize noise coupling between the BTL and TTL
sides. These pins should be tied to a common ground external to the
package.
Each BTL driver has an associated BUS GND pin that acts as a
signal return path and these BUS GND pins are internally isolated
from each other. In the event of a ground return fault, a “hard” signal
failure occurs instead of a pattern dependent error that may be very
infrequent and impossible to trouble- shoot.
As with any high power device thermal considerations are
critical. It is recommended that airflow (300Ifpm) and/or thermal
mounting be used to ensure proper junction temperature.


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