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SY89837U Datasheet(PDF) 7 Page - Micrel Semiconductor |
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SY89837U Datasheet(HTML) 7 Page - Micrel Semiconductor |
7 / 14 page 7 Precision Edge® SY89837U Micrel, Inc. M9999-022007 hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings(1) Supply Voltage (V CC) ................................... –0.5V to +4.0V Input Volage (V IN) ........................................... –0.5V to VCC LVPECL Output Current (I OUT) Continuous .............................................................. 50mA Surge .................................................................... 100mA Termination Current(3) Source or sink current on V T ...................................... ±100mA Lead Temperature (soldering, 20 sec.) ..................... 260°C Storage Temperature (T S) ........................ –65°C to +150°C Operating Ratings(2) Supply Voltage (V CC) ........................... +2.375V to +2.625V ............................................................. +3.0V to +3.6V Ambient Temperature (T A) ......................... –40°C to +85°C Package Thermal Resistance(4) MLF® (θ JA) Stll-Air .............................................................. 35°C/W MLF® (Ψ JB) Junction-to-board ............................................ 16°C/W TA = –40°C to +85°C; unless noted. Symbol Parameter Condition Min Typ Max Units VCC Power Supply 2.5V nominal 2.375 2.625 V 3.3V nominal 3.0 3.6 V ICC Power Supply Current No load, max. VCC 115 160 mA RIN Input Resistance (IN-to-VT) 455055 ý RDIFF_IN Differential Input Resistance 90 100 110 ý (IN-to-/IN) VIH Input High Voltage (IN-to-/IN) 1.2 VCC V VIL Input Low Voltage (IN-to-/IN) 0 VIH–0.2 V VIN Input Voltage Swing (IN-to-/IN) See Figure 1a.(6) 0.2 VCC V VDIFF_IN Differential Input Voltage Swing See Figure 1b. 0.4 V |IN–/IN| VIN_LOS Input Voltage Swing when signal 100 200 mV is lost VT_IN IN-to-VT (IN-to-/IN) 1.8 V VREF_AC Output Reference Voltage VCC–1.3 VCC–1.2 VCC–1.1 V (VREF-AC) Notes: 1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. yJB uses a 4-layer qJA in still air unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. VIN (max.) is specified when VT is floating. DC ELECTRICAL CHARACTERISTICS(5) |
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