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SY89827LHYTR Datasheet(PDF) 5 Page - Micrel Semiconductor

Part # SY89827LHYTR
Description  3.3V 500MHz DUAL 1:10 HSTL FANOUT BUFFER/TRANSLATOR WITH 2:1 MUX INPUT
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

SY89827LHYTR Datasheet(HTML) 5 Page - Micrel Semiconductor

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5
Precision Edge®
SY89827L
Micrel, Inc.
M9999-011907
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(Note 1)
Power Supply Voltage (V
CCI, VCCO) .............. –0.5 to +4.0V
Input Voltage (V
IN) ........................................... –0.5 to VCCI
Output Current (I
OUT) ............................................... –50mA
Lead Temperature (T
LEAD, Soldering, 20sec.) .......... 260°C
Storage Temperature (T
S) ........................... –65 to +150°C
ESD Rating, Note 3 .................................................... >1kV
Operating Ratings(Note 2)
Supply Voltage
(V
CCI) .................................................... +3.3V to +3.47V
(V
CCO) ..................................................... +1.6V to +2.0V
Ambient Temperature (T
A) ......................... –40°C to +85°C
Package Thermal Resistance
TQFP
JA)
Exposed pad soldered to GND, Note 4
Still-Air (multi-layer PCB) ................................. 23
°C/W
–200lfpm (multi-layer PCB) ............................. 18
°C/W
–500lfpm (multi-layer PCB) ............................. 15
°C/W
Exposed pad NOT soldered to GND (not recommended)
Still-Air (multi-layer PCB) ................................. 44
°C/W
–200lfpm (multi-layer PCB) ............................. 36
°C/W
–500lfpm (multi-layer PCB) ............................. 30
°C/W
TQFP
JC) ......................................................... 4.4°C/W
Power Supply: T
A = –40°C to +85°C
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CCI
V
CC Core
3.13
3.3
3.47
V
V
CCO
V
CC Output
1.6
1.8
2.0
V
I
CCI
I
CC Core
No Load
140
170
mA
HSTL Input/Output: V
CCI = 3.3V ±5%, VCCO = 1.8V ±10%, TA = –40°C to +85°C
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
OH
Output HIGH Voltage
Note 5
1.0
1.2
V
V
OL
Output LOW Voltage
Note 5
0.2
0.4
V
V
IH
Input HIGH Voltage
VX +0.1
1.6
V
V
IL
Input LOW Voltage
–0.3
VX –0.1
V
V
X
Input Crossover Voltage
0.68
0.9
V
I
IH
Input HIGH Current
+20
–350
µA
I
IL
Input LOW Current
–500
µA
Note 1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions
for extended periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
Devices are ESD sensitive. Handling precautions recommended.
Note 4.
It is highly recommended to solder the exposed pad of the EPAD-TQFP package to a ground plane on the PCB for maximum thermal
efficiency.
Note 5.
Outputs loaded with 50
Ω-to-ground.
DC ELECTRICAL CHARACTERISTICS


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