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SY89543L Datasheet(PDF) 3 Page - Micrel Semiconductor

Part No. SY89543L
Description  3.3V, 3.2Gbps DUAL, DIFFERENTIAL 2:1 LVDS MULTIPLEXER with INTERNAL TERMINATION
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Maker  MICREL [Micrel Semiconductor]
Homepage  http://www.micrel.com
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SY89543L Datasheet(HTML) 3 Page - Micrel Semiconductor

 
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3
Precision Edge®
SY89543L
Micrel, Inc.
M9999-071505
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (VCC) ................................. –0.5V to +4.0V
Input Voltage (VIN) ........................................ –0.5V to VCC
Termination Current(3)
Source or sink current on VT ..................................... ±100mA
Input Current
Source or sink current on IN, /IN ..........................
±50mA
Lead Temperature (soldering, 20 sec.) ................... +260
°C
Storage Temperature (TS) ....................... -65°C to +150°C
Operating Ratings(2)
Supply Voltage (VCC) ..................................... 3.0V to 3.6V
Ambient Temperature (TA) ........................ –40°C to +85°C
Package Thermal Resistance(4)
MLF™ (
θ
JA)
Still-Air ................................................................ 35
°C/W
500lfpm .............................................................. 28
°C/W
MLF™ (
ψ
JB)
Junction-to-Board ............................................... 20
°C/W
TA = –40°C to +85°C; Unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
3.0
3.3
3.6
V
ICC
Power Supply Current
No Load, Max. VCC
(6)
66
88
mA
RDIFF_IN
Differential Input Resistance
80
100
120
(IN-to-/IN)
RIN
Input Resistance
40
50
60
(IN-to-VT, /IN-to-VT)
VIH
Input High Voltage (IN, /IN)
Note 7
VCC–1.6
VCC
V
VIL
Input Low Voltage (IN, /IN)
Note 7
0VIH–0.1
V
VIN
Input Voltage Swing (IN, /IN)
Notes 7, 8
100
VCC
mV
VDIFF_IN
Differential Input Voltage Swing
Notes 7, 8
200
2
×V
CC
mV
|IN - /IN|
IN-to-VT
Voltage from Input to VT
1.8
V
Notes:
1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.
Ψ
JB uses 4-layer
θ
JA in still air unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. Includes current through internal 50
Ω pull-ups.
7. VIH(min) not lower than 1.2V.
8. See “Operating Characteristics” section for VIN and VDIFF_IN definition.
DC ELECTRICAL CHARACTERISTICS(5)


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