Micrel, Inc.

SY89202U

June 2006

M9999-061206-B

5

Termination Current

Output Current

Source or sink current on IN, /IN................ ±50mA

Lead Temperature (soldering, 20 sec.)............ +260°C

........................................................ +3.0V to +3.6V

Package Thermal Resistance

(4)

MLF

Still-Air ........................................................ 35°C/W

MLF

Junction-to-Board ...................................... 20°C/W

Symbol

Parameter

Condition

Min

Typ

Max

Units

V

CC

Power Supply

2.375

3.0

2.625

3.6

V

V

I

CC

Power Supply Current

No load, max. V

CC

125

180

mA

R

DIFF_IN

Differential Input Resistance

(IN-to-/IN)

90

100

110

Ω

R

IN

Input Resistance

(IN-to-V

45

50

55

Ω

V

IH

Input High Voltage

(IN, /IN)

1.2

V

CC

V

V

IL

Input Low Voltage

(IN, /IN)

0

V

V

V

IN

Input Voltage Swing

(IN, /IN)

See Figure 1a.

100

V

CC

mV

V

DIFF_IN

Differential Input Voltage Swing

|IN-/IN|

See Figure 1b.

200

mV

V

REF-AC

Output Reference Voltage

(V

V

V

V

V

IN-to-V

T

Voltage from Input to V

T

1.8

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings

conditions for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.